| Multilayer
package Destination |
Base
Material
Component |
Minimum
buildup
thickness |
Copper
thickness |
Maximum
unpierced Cu. |
Maximum
temperature rating |
Flarrability
rating |
Solder
limits
time/temperature: |
| Multiclad |
FR4 |
.025 |
1/2 oz.
ext.
3 0z. int. |
2.0" |
130
C |
94VO |
30
sec./288 C |
Sample letter to U.L.
requesting CCMP's grade be added to your file:
Underwriters Laboratories,
Inc.
Street Address
City, State, Zip
Attn: (your U.L. Contact)
Dear U.L. Contact,
Please add the following supplier and recognized component to our existing
U.L. file # (your file #), as provided for in the CCIL program.
Supplier
CopperClad Multilayer
Products MultiClad
File# E158006
Sincerely, |
Recognized Component
MultiClad |
|