To achieve maximum speed and efficiency, the CCMP mass lam manufacturing facility was designed to process inner layers on formats of up to 24" X 49". To ensure a winning mass lam program, we encourage you to familiarize yourself with the following guidelines for manufacturability
Manufacturing Capabilities
Lamination: Maximum number of layers 422  
Minimum O/A thickness .025
Maximum O/A thickness .250
Maximum process size 24.5"x 49.0"
Overall thickness and tolerance requirements: .037 +/- .002
.049 +/- .0025
.058 +/- .0035
.089 +/- .005
.120 +/- .006
Dielectric tolerance requirements: .005 - .009 +/- .00075
.010 - .017 +/- .0015
.018 - .023 +/- .002
.024 and above + 7.5%
Printing and etching conductor width minimums: Production Limited Production
1/2 oz. cu. .0035 .003
1 oz. cu. .0035 .003
2/1 (gnd/sig) oz. cu. .0045

.0040
2/2 (gnd/sig) oz. cu. .006 .005
3 oz. int. .010 .008
Conductor width tolerances: 1/2 oz. cu +/- .0005
1 oz. cu +/- .0005
2 oz. cu +/- .001
3 oz. cu +/- .002
Registration requirements: Hole to inner layer pad minimums (no break out)
4 layer .0035
6 layer .0023
8 layer .004
10 layer .0059
Hole to inner layer clearance: (too short)
4-24 layers .009